1.scope shoulde r?s saw filter series have broad line up products meeting all broadcast standard including ntsc,pal and secam systems. these filters are composed of two interdigital transducers on a single -crystal. piezoelectrical chip. they are used in electronic equipme nts such as tv and so on. 2.construction 2.1 dimension and materials type : BF23A1D 3 . 0 1 . 2 5 14.0 2.54 0.54 5 . 8 4 . 0 1 2 3 4 5 pin configuration 1 input 2 input-ground 3 chip carrier-ground 4 output 5 output hd 1 5 BF23A1D 0b
2.2. circuit construction, measurement circuit 3.characteristics standard atmospheric conditions unless otherwise specified , the standard rang of atmospheric conditions for making measurements and tests is as follows; ambient temperature : 15?? to 35?? relative humidity : 25% to 85% air pressure : 86kpa to 106kpa operating temperature rang operating temperature rang is the rang of ambient temperatures in which the filter can be operated continuously. - 10?? ~ +60?? storage tempera ture rang storage temperature rang is the rang of ambient temperatures at which the filter can be stored without damage. conditions are as specified elsewhere in these specifications. - 40?? ~ +70?? reference temperature +25?? 3.1 maximum rating dc voltage vdc 12 v between any terminals ac voltage vpp 10 v between any terminals
3.2 electrical characteristics source impedance zs=50|? load impedance z l =2k|?//3pf t a =25?? item freq min typ max center frequency fo - 23.4 - mhz insertion attenuation reference level 43.81mhz 9.8 11.8 13.8 db b 3db - 1.8 - mhz pass bandwidth b 30db - 3.1 - mhz 15.06~20.66mhz 36.0 42.0 db 20.06~21.66mhz 34.0 40.0 db 25.26~26.26mhz 33.0 38.0 db sidelobe 26.26~35.06mhz 36.0 42.0 db temperature coefficient - 72 ppm/k 3.3 environmental performance characteristics item test condition allowable change of absolute level at center frequency(db) high temperature test 70?? 500h < 1.0 low temperature test - 40?? 500h < 1.0 h umidity test 40?? 90- 95% 500h < 1.0 thermal shock - 20??==25??==80?? 5 cycle 30m 10m 30m < 1.0 solder temperature test sold temp.260?? for 10 sec. < 1.0 soldering immerse the pins melt solder at 260??+5/- 0?? for 5 sec. more then 95% of total area of the pins should be covered with solder 3.4 mechanical test item test condition al lowable change of absolute level at center frequency(db) vibration test 600- 3300rpm amplitude 1.5mm 3 directions 2 h each <1.0 drop test on maple plate from 1 m high 3 times <1.0 lead pull test pull with 1 kg force for 30 seconds <1.0 lead bend test 90 o bending with 500g weigh 2 times <1.0
3.5 voltage discharge test item test condition allowable change of absolute level at center frequency(db) surge test between any two electrode <1.0 3.6 frequency response
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